Laser Cutting Machine

LCP-30 laser cutting machine suit cutting,drilling,engraving PCD,PCBN,CVD,diamond,tungsten carbide,cearmics and slilicon wafer

 LCP-30 laser cutting machine

Main technical parameters

(1) Repetition frequency: 100Hz

(2) Impulse duration: 64μs

(3) Average power : ≥30

(4) Laser wave length : 1064nm

(5) Power instability : ±5%

(6) Continuous working time : ≥8Hrs

(7) The thickness of work piece for single-sided cutting: ≥3.5mm

(8) Outline dimension190×70×150cm

(9) AC power :  380V

(10)Total Weight:   280kg

Features and properties.

                                                  Introduction for LCP 30:

Machine Type	Power	Depth of Cut					Kerf Width	Speed Recommended in cutting 1mm thick PCD	Applications	Remarks
		Solid PCD Inserts	PCD and PCBN backed with cemented tungsten carbide	Solid PCBN Inserts	Cemented Carbide	Ceramics, Silicon Wafer
LCP30	30W	2.5mm	3.2mm	3.2mm	3.2mm	3.5mm	0.05-0.15mm	45mm/min	Cutting, Drilling, Engraving	Good quality with excellent efficiency. Typically recommended to cut cutting tool blanks with maximal thickness 2.0 millimeters

The main components.

This machine is comprised of five systems,including Laser Generating System, Light Focusing Guide System, Coaxial Real-time Monitored Control System, Cooling System and Movement Control System.

 laser Generating System: made up of laser machine and power for it.

Included components listed as follows:

Holophote, Output Mirror, 45°holophote, Pumping Xenon Lamp , Prefocus Cavern, Yag Crystals, Extender Lens, Assistant HeNe laser instrument (used to adjustment of ray path and guide for light beam position)

Light Focusing Guide System.

Real-time Monitored Control System : making up of Microscope or Optical Projection System or CCD Picture Pick-up System

Cooling System

Laser Cutting Machine